With more than 500 experienced workers and technical team, IBE can offer 150,000 square meters per month. Plant covering 200,000 square meters with the imported and maximum precision facilities, manufacturing lines are totally automation, and chemical are the result of the latest research. Meanwhile, you can be sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and TS16949 approval.Our products include 1-10 layers of simple to high density boards;flex circuits and rigid flex boards, which are the substrate of consumer electronic merchandize, communication device, industrial automation machine, IT product, medical equipment and automotive electronics etc.We handle all types of pcb assembly, from basic through hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including telecommunications, aviation, consumer electronics, wireless, medial, automotive and instrumentation.

PCBA Capability

PCB Manufacturing Capability
PCB Layers:	1Layers to 18 layer (Max)
Board thickness:	0.13~6.0mm
Min line width/space:	3mil
Min mechanical hole size:	4mil
Copper thickness:	9um~210um(0.25oz~6oz)
Max aspect ratio:	1:10
Max board size:	400*700mm
Surface Finish:	HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material:	FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range:	1560*450mm
Min SMT package:	0402/1005(1.0x0.5mm)
Min IC pitch:	0.3mm
Max PCB Size:	1200*400mm
Min PCB thickness:	0.35mm
Min Chip Size:	01005
Max BGA Size:	74*74mm
BGA Ball Pitch:	1.00~3.00mm
BGA Ball Diameter:	0.4~1.0mm
QFP Lead Pitch:	0.38~2.54mm
Testing :	ICT,AOI,X-RAY,Funtional test etc.

Certification:
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We integrate our resources and manage production through MES system which can well optimize process and guarantee quality.Besides,IBE Group adheres strictly to the production and manufacturing standards of TS16949,automobile industry and ISO 13485,medical industry.

IBE Electronics Co.,ltd has been serving the contract manufacturing (ODM,OEM/EMS), industry for 25 years in China. The service includes Electronic Device Design , PCB Fabrication, components sourcing, PCB Assembly,conformal coating, sub-assembly and programming&testing, to final box packing, a Turnkey Solution. To expand the business and provide better services to North American customers, IBE opened  new facilities IBE (USA) in 40760 Encyclopedia Cir,Fremont, CA, 94538 in 2017, and IBE(Vietnam) in Dai Dong Industrial Zone-Hoan Son, Hoan Son Commune, Tien Du District, Bac Ninh Province, which can provide a full range of PCB assembly service. IBE continues to invest in new technologies, providing a complete manufacturing solution to meet customers' needs and make the process more economical. Our major products are in markets of IOT,Smart Metering,Medical Device,Automotive Electronic Device,Industrial mather board, and laser devices.

Our main customers: BMW, TELSA, EATON, BOSCH, ABB, Honeywell...

Bare PCB capacity: 150000sqm/month

PCB ability:2layers ~28layers

Assembly capacity: 350,000components/hour

Assembly Ability: Min components:0201

Lead time: quick turn: 24hours

Advantage: No MOQ, short lead time, TS16949/ISO14001/ISO13485 qualified process, cost effectiveness

Welcome to make inquiry with Gerber file and Bom lists!