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UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

    Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
     
    Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers
    • Buy cheap UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold from wholesalers

    UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

    Ask Lasest Price
    Brand Name : IBE
    Model Number : multilayer pcb
    Certification : ISO/TS16949 ISO13485
    Price : $0.1-$0.5
    Payment Terms : D/A, L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 50000pcs/week
    Delivery Time : 5-8 working days
    • Product Details
    • Company Profile

    UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold

    China multilayer pcb manufacturing pcb fabrication 16L RFID PCB with UL approval

    PCBA Capability

    PCB Manufacturing Capability
    PCB Layers:1Layers to 18 layer (Max)
    Board thickness:0.13~6.0mm
    Min line width/space:3mil
    Min mechanical hole size:4mil
    Copper thickness:9um~210um(0.25oz~6oz)
    Max aspect ratio:1:10
    Max board size:400*700mm
    Surface Finish:HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
    Material:FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
    PCB Assembly Capability
    Stencil size range:1560*450mm
    Min SMT package:0402/1005(1.0x0.5mm)
    Min IC pitch:0.3mm
    Max PCB Size:1200*400mm
    Min PCB thickness:0.35mm
    Min Chip Size:01005
    Max BGA Size:74*74mm
    BGA Ball Pitch:1.00~3.00mm
    BGA Ball Diameter:0.4~1.0mm
    QFP Lead Pitch:0.38~2.54mm
    Testing :ICT,AOI,X-RAY,Funtional test etc.

    Delivery Time:
    Order Conditions
    Standard Delivery Date
    The fastest Delivery Date
    Prototype ( <20pcs)
    2days
    8hours
    Small Volume (20-100pcs)
    6days
    12hours
    Medium Volume (100-1000)
    3days
    24hours
    Mass Production (>1000)
    Depends on BOM
    Depends on BOM

    Quality UL 16L Rfid Printed Circuit Board Fabrication Immersion Gold for sale
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