Communication System PCBA BGA QFN Assembly

PCBA Capability

SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.

The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.

Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.

Delivery Time:

Order Conditions	Standard Delivery Date	The fastest Delivery Date
Prototype ( <20pcs)	2days	8hours
Small Volume (20-100pcs)	6days	12hours
Medium Volume (100-1000)	3days	24hours
Mass Production (>1000)	Depends on BOM	Depends on BOM

IBE Electronics Co.,ltd has been serving the contract manufacturing (ODM,OEM/EMS), industry for 25 years in China. The service includes Electronic Device Design , PCB Fabrication, components sourcing, PCB Assembly,conformal coating, sub-assembly and programming&testing, to final box packing, a Turnkey Solution. To expand the business and provide better services to North American customers, IBE opened  new facilities IBE (USA) in 40760 Encyclopedia Cir,Fremont, CA, 94538 in 2017, and IBE(Vietnam) in Dai Dong Industrial Zone-Hoan Son, Hoan Son Commune, Tien Du District, Bac Ninh Province, which can provide a full range of PCB assembly service. IBE continues to invest in new technologies, providing a complete manufacturing solution to meet customers' needs and make the process more economical. Our major products are in markets of IOT,Smart Metering,Medical Device,Automotive Electronic Device,Industrial mather board, and laser devices.

Our main customers: BMW, TELSA, EATON, BOSCH, ABB, Honeywell...

Bare PCB capacity: 150000sqm/month

PCB ability:2layers ~28layers

Assembly capacity: 350,000components/hour

Assembly Ability: Min components:0201

Lead time: quick turn: 24hours

Advantage: No MOQ, short lead time, TS16949/ISO14001/ISO13485 qualified process, cost effectiveness

Welcome to make inquiry with Gerber file and Bom lists!