PCB Assembly Customized Buried buried resistance capacity Circuit
Boards DIP/SMT China Manufacturer
Buried resistance is a thin film electrodeposited on copper NiP
metal alloy (resistor conductor material). The alloy is laminated
to a dielectric and subtractively processed to produce planar
resistors. Due to the thin film nature, it can be buried within
layers – without increasing the thickness of the board or occupying
surface space (like discrete resistors).
Improves line impedance matching.
Reduces signal paths & series inductance.
Reduces cross talk, noise and EMI.
Enhances performance of cost-effective resistor technology in high
speed high density circuit layout.
Eliminates discrete resistors.
Lead free compatible.
Stable through a wide frequency range 20+Ghz.
About IBE Corporation
IBE keeps making breakthroughs in technology and production to lead
the EMS industrial and build a one-stop solution integrating material purchasing, production processing and
finished
product reliability test which enable our customer to achieve
meaningful time to market and save cost.
Our products are widely applied in Automotive,Medical,Defense and
Aerospace,Power Supply,Smart Metering industry,etc.
We've good cooperation with many famous enterprises,such as
Flextronics,Foxconno,ABB,AEC,Jabil,Valeo,Bushnell,Sanmina, Grammer
and so on.
High quality and competitive price let IBE obtain the trust of our clients from all over the world.
With strong manufacturing and producing capacities and the
practical application in all fields,IBE Group has achieved stable
increase of sales volume year by year.
Since established in 1998,over 20 years of innovation and
development,IBE Group has set up four processing and manufacturing
bases including the headquarters in Shenzhen, and a manufacturing
factory in Portland,America.In addition, our EMS factory in Vietnam.
Certification:
Certified by ISO 9001 and 14001,IBE is a well-equipped and strictly managed manufacturer.We
integrate our resources and manage production through MES system
which can well optimize process and guarantee quality.Besides,IBE
Group adheres strictly to the production and manufacturing
standards of IATF16949,automobile industry and ISO 13485,medical industry.
Production capability:
| SMT and Through-Hole Assembly | Fine Pitch Component Insertion |
| Lead free Assembly | BGA and QFN Assembly |
| One-stop PCB Assembly | BGA X-Ray Inspection |
| Prototype PCB Assembly | Automated Optical Inspection |
| PCB Assembly in low volumes | PCB testing for functionality |
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection | In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI
minimizing functional defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing |
| Selective Wave Soldering | Conformal Coating |
| Complete box build | Kitting and 3D printing |
FAQ:
Q: What service do you have?
A: We provide PCB,components sourcing,PCB assembly,box build,R &D services.
Q: What is your minimum order quantity (MOQ)?
A:As for MOQ, we have no request about it. Even 1 pcs is ok for us.
Q: What is needed for PCB & PCBA quotation?
A: Gerber fie,Bom list and production technical requirements.
Q: How to keep our product information and design file secret ?
A: We are willing to sign a NDA effect by customers side local law
and promising tokeep customers data in high confidential level.
