OEM Multilayer High Tg HDI PCB Printed Circuit Board and Circuit Board PCB Manufacturer in Shenzhen, China

PCBA Capability

PCB Manufacturing Capability
PCB Layers:	1Layers to 18 layer (Max)
Board thickness:	0.13~6.0mm
Min line width/space:	3mil
Min mechanical hole size:	4mil
Copper thickness:	9um~210um(0.25oz~6oz)
Max aspect ratio:	1:10
Max board size:	400*700mm
Surface Finish:	HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask
Material:	FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE.
PCB Assembly Capability
Stencil size range:	1560*450mm
Min SMT package:	0402/1005(1.0x0.5mm)
Min IC pitch:	0.3mm
Max PCB Size:	1200*400mm
Min PCB thickness:	0.35mm
Min Chip Size:	01005
Max BGA Size:	74*74mm
BGA Ball Pitch:	1.00~3.00mm
BGA Ball Diameter:	0.4~1.0mm
QFP Lead Pitch:	0.38~2.54mm
Testing :	ICT,AOI,X-RAY,Funtional test etc.

Delivery Time:

Order Conditions	Standard Delivery Date	The fastest Delivery Date
Prototype ( <20pcs)	2days	8hours
Small Volume (20-100pcs)	6days	12hours
Medium Volume (100-1000)	3days	24hours
Mass Production (>1000)	Depends on BOM	Depends on BOM

FAQ:

1. What information is required for a turnkey PCB assembly order?

For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file

2. Do you offer testing and inspection services?

Yes, IBE offers a comprehensive list of testing and inspection services for both SMT and through-hole assemblies.
Visual inspection/scanning microscopes
AOI inspection
In-circuit test
Functional testing include automated test equipment and system
Burn-in tests
Low/High Temp Chamber Testing
X-ray inspection and repair
Salt fog tester
Drop Test
packing vibration
Conformal coating and potting

3. What are your PCB assembly standards?

IBE has obtained the following IPC electronics industry standards for PCB assembly
IPC-A-600G for PCB production
IPC-620 for practices and requirements for cables, wire, and harness assembly manufacturing
IPC-A-610E PCBA Acceptability of Electronic Assemblies

IBE Electronics Co.,ltd has been serving the contract manufacturing (ODM,OEM/EMS), industry for 25 years in China. The service includes Electronic Device Design , PCB Fabrication, components sourcing, PCB Assembly,conformal coating, sub-assembly and programming&testing, to final box packing, a Turnkey Solution. To expand the business and provide better services to North American customers, IBE opened  new facilities IBE (USA) in 40760 Encyclopedia Cir,Fremont, CA, 94538 in 2017, and IBE(Vietnam) in Dai Dong Industrial Zone-Hoan Son, Hoan Son Commune, Tien Du District, Bac Ninh Province, which can provide a full range of PCB assembly service. IBE continues to invest in new technologies, providing a complete manufacturing solution to meet customers' needs and make the process more economical. Our major products are in markets of IOT,Smart Metering,Medical Device,Automotive Electronic Device,Industrial mather board, and laser devices.

Our main customers: BMW, TELSA, EATON, BOSCH, ABB, Honeywell...

Bare PCB capacity: 150000sqm/month

PCB ability:2layers ~28layers

Assembly capacity: 350,000components/hour

Assembly Ability: Min components:0201

Lead time: quick turn: 24hours

Advantage: No MOQ, short lead time, TS16949/ISO14001/ISO13485 qualified process, cost effectiveness

Welcome to make inquiry with Gerber file and Bom lists!