China's Largest PCB Prototype Manufacturer, offers 24 hours Quick
Turn PCB prototype, SMT assembly
With more than 500 experienced workers and technical team, IBE can
offer 15,000 square meters per month. Plant covering 200,000 square
meters with the imported and maximum precision facilities,
manufacturing lines are totally automation, Meanwhile, you can be
sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and
TS16949 approval.Our products include 1-10 layers of simple to high
density boards;flex circuits and rigid flex boards, which are the
substrate of consumer electronic merchandize, communication device,
industrial automation machine, IT product, medical equipment and
automotive electronics etc.We handle all types of pcb assembly,
from basic through hole PCB assembly to standard surface mount PCB
assembly to ultra-fine pitch BGA assembly. Our engineers work with
customers from across all fields including telecommunications,
aviation, consumer electronics, wireless, medial, automotive and
instrumentation.
Our Advantages:
1, Factory Area:60000㎡ Shenzhen factory; two other factories in US
and Vietnam.
2, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI
Test,IQC,QC,QA,100% Functional Test
3, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High
TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test,
OEM/ODM Serivce
4, Certifcation:ATF 16949,ISO 13485,ISO
14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold
Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded
Capacitance, Local Mixed Pressure, Local High Density, Back Drill,
Impedance Control |
