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Halogen Free 94v0 Through Hole PCB Assembly Hard Gold Plating

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IBE ELectronics Co.,LTD

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Halogen Free 94v0 Through Hole PCB Assembly Hard Gold Plating

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Brand Name :	IBE
Model Number :	FG-01
Certification :	UL,ROHS
Payment Terms :	L/C, T/T
Delivery Time :	15 WORKING DAYS
Price :	Negotiable

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Product Details
Company Profile

Halogen Free 94v0 Through Hole PCB Assembly Hard Gold Plating

SMT PCB Board and PCBA Electric Contract Assembly in Shenzhen, China

Surface Mount PCB Assembly

On our state-of-the-art SMT assembly lines, we make electronic products from small-sized to large series. The great PCB assembly performance, repeatability, availability, and population, and soldering quality, as well as the automated optical inspection, meet the highest demands of our clients.

Our SMT electronic assembly capabilities are far superior to those of our competitors and we take pride in this fact. We have a highly-trained staff who are very skilled at manufacturing a wide range of PCB boards through SMT assembly.

Our Advantages

1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce

2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam

3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,

4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test

1	Material	PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers
2	Board Thickness	Mass Production:0.3-3.5mm Samples:0.21-6.0mm
3	Surface Finish	HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating
4	PCB Panel Size	Max Mass Productoin: 610x460mm Sample:762x508mm
5	Layer	Mass production:2-58 Layers, Samples:1-64 Layers
6	Min. Drill Hole Size	Laser Drill 0.1mm,Machine Drill 0.2mm
7	PCBA QC	X-ray,AOI Test,Functional Test
8	Speciality	Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc
9	Sanforized	Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control

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