IATF/TS16949,ISO13485 Certified SMT PCB Assembly
Production capability
IBE Group invested in modernized equipment,such as automatic
multi-layered PCB production equipment,high speed chip mounters and
online SPI machines.Our PCB production capacity is up to 180,000
square meters a month.We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
IBE can mount chip components including 0201 and 01005 as well as QFP,BGA and fine pitch parts down to 0.3mm precision.
We can do many kinds of test,like X-Ray,Rohs,temperature test,Push and Pull test.
Our Advantages
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High
TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test,
OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US
and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO
14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI
Test,IQC,QC,QA,100% Functional Test
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold
Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded
Capacitance, Local Mixed Pressure, Local High Density, Back Drill,
Impedance Control
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Globe Services
